Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating
Microvia interconnectors are a critical element of 3D packaging technology, as they provide the shortest interconnection path between stacked chips. However, low efficiency of microvia filling is a long-standing problem. This study proposed a two-step method to enhance the electroplating filling eff...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-05-01
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| Series: | Nanomaterials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-4991/12/10/1699 |