Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating
Microvia interconnectors are a critical element of 3D packaging technology, as they provide the shortest interconnection path between stacked chips. However, low efficiency of microvia filling is a long-standing problem. This study proposed a two-step method to enhance the electroplating filling eff...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-05-01
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| Series: | Nanomaterials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-4991/12/10/1699 |
| _version_ | 1797497283591274496 |
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| author | Ganglong Li Zhiyi Li Junjie Li Houya Wu |
| author_facet | Ganglong Li Zhiyi Li Junjie Li Houya Wu |
| author_sort | Ganglong Li |
| collection | DOAJ |
| description | Microvia interconnectors are a critical element of 3D packaging technology, as they provide the shortest interconnection path between stacked chips. However, low efficiency of microvia filling is a long-standing problem. This study proposed a two-step method to enhance the electroplating filling efficiency by pre-setting metal particles in microvias and later electroplating the Cu to fill the gaps among the pre-settled particles. Since these particles occupy a certain volume in the microvia, less electroplating Cu is needed for microvia filling, leading to a shorter electroplating period. |
| first_indexed | 2024-03-10T03:16:14Z |
| format | Article |
| id | doaj.art-6674674b71a2494eb1abb8de416026a2 |
| institution | Directory Open Access Journal |
| issn | 2079-4991 |
| language | English |
| last_indexed | 2024-03-10T03:16:14Z |
| publishDate | 2022-05-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Nanomaterials |
| spelling | doaj.art-6674674b71a2494eb1abb8de416026a22023-11-23T12:26:49ZengMDPI AGNanomaterials2079-49912022-05-011210169910.3390/nano12101699Fast Filling of Microvia by Pre-Settling Particles and Following Cu ElectroplatingGanglong Li0Zhiyi Li1Junjie Li2Houya Wu3School of Mechanical and Electronic Engineering, East China University of Technology, Nanchang 330013, ChinaState Key Laboratory of High Performance Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, ChinaShenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, ChinaState Key Laboratory of High Performance Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, ChinaMicrovia interconnectors are a critical element of 3D packaging technology, as they provide the shortest interconnection path between stacked chips. However, low efficiency of microvia filling is a long-standing problem. This study proposed a two-step method to enhance the electroplating filling efficiency by pre-setting metal particles in microvias and later electroplating the Cu to fill the gaps among the pre-settled particles. Since these particles occupy a certain volume in the microvia, less electroplating Cu is needed for microvia filling, leading to a shorter electroplating period.https://www.mdpi.com/2079-4991/12/10/1699microvia fillingnanoparticleelectroplatingadvanced packaging |
| spellingShingle | Ganglong Li Zhiyi Li Junjie Li Houya Wu Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating Nanomaterials microvia filling nanoparticle electroplating advanced packaging |
| title | Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating |
| title_full | Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating |
| title_fullStr | Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating |
| title_full_unstemmed | Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating |
| title_short | Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating |
| title_sort | fast filling of microvia by pre settling particles and following cu electroplating |
| topic | microvia filling nanoparticle electroplating advanced packaging |
| url | https://www.mdpi.com/2079-4991/12/10/1699 |
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