The integration of double-layer triangular micro-channel in three-dimensional integrated circuits for enhancing heat transfer performance
This paper proposed a new heat dissipation structure called double-layer triangular micro-channel (DLTMC) to solve the increasingly serious thermal problem of three-dimensional integrated circuits (3D-ICs). The matrix equation of heat transmission is established to derive steady-state temperature of...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-06-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X24003940 |