The integration of double-layer triangular micro-channel in three-dimensional integrated circuits for enhancing heat transfer performance
This paper proposed a new heat dissipation structure called double-layer triangular micro-channel (DLTMC) to solve the increasingly serious thermal problem of three-dimensional integrated circuits (3D-ICs). The matrix equation of heat transmission is established to derive steady-state temperature of...
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| Format: | Article |
| Language: | English |
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Elsevier
2024-06-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X24003940 |
| _version_ | 1797199833950322688 |
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| author | Huan Huang Zong-jie Zeng Peng Xu |
| author_facet | Huan Huang Zong-jie Zeng Peng Xu |
| author_sort | Huan Huang |
| collection | DOAJ |
| description | This paper proposed a new heat dissipation structure called double-layer triangular micro-channel (DLTMC) to solve the increasingly serious thermal problem of three-dimensional integrated circuits (3D-ICs). The matrix equation of heat transmission is established to derive steady-state temperature of 3D-ICs with embedded DLTMC, which is based on equivalent thermal resistance network. According to proposed computation thermal model, the heat transfer performances of 3D-ICs with embedded DLTMC concerning different cooling liquids are investigated, where the impacts of different bottom angle of DLTMC, volume concentration of nanofluid and flow velocity of cooling liquid are considered. The results show that the proposed DLTMC structure can significantly reduce steady-state temperature compared with conventional structure of single layer rectangular micro-channel (SLRMC), the corresponding steady-state temperature for them can be reduced over 32.098 %. Besides, it is demonstrated that the steady-state temperature for MWCNT-water and SWCNT-water nanofluids as cooling liquids can be reduced by 22.490 % and 19.801 % than conventional water case, respectively. Moreover, it is manifested that the increase of bottom angle of DLTMC, volume concentration of nanofluid and flow velocity of cooling liquid can evidently improve heat transfer performance of 3D-ICs. Therefore, the presented results in this paper are beneficial for solving complex thermal problems of 3D-ICs. |
| first_indexed | 2024-04-24T07:22:03Z |
| format | Article |
| id | doaj.art-66acf3c35317438a8f7f128b13973769 |
| institution | Directory Open Access Journal |
| issn | 2214-157X |
| language | English |
| last_indexed | 2024-04-24T07:22:03Z |
| publishDate | 2024-06-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Case Studies in Thermal Engineering |
| spelling | doaj.art-66acf3c35317438a8f7f128b139737692024-04-21T04:14:24ZengElsevierCase Studies in Thermal Engineering2214-157X2024-06-0158104363The integration of double-layer triangular micro-channel in three-dimensional integrated circuits for enhancing heat transfer performanceHuan Huang0Zong-jie Zeng1Peng Xu2School of Electronics and Information, Guangdong Polytechnic Normal University, Guangzhou, 510665, ChinaSchool of Electronics and Information, Guangdong Polytechnic Normal University, Guangzhou, 510665, ChinaCorresponding author.; School of Electronics and Information, Guangdong Polytechnic Normal University, Guangzhou, 510665, ChinaThis paper proposed a new heat dissipation structure called double-layer triangular micro-channel (DLTMC) to solve the increasingly serious thermal problem of three-dimensional integrated circuits (3D-ICs). The matrix equation of heat transmission is established to derive steady-state temperature of 3D-ICs with embedded DLTMC, which is based on equivalent thermal resistance network. According to proposed computation thermal model, the heat transfer performances of 3D-ICs with embedded DLTMC concerning different cooling liquids are investigated, where the impacts of different bottom angle of DLTMC, volume concentration of nanofluid and flow velocity of cooling liquid are considered. The results show that the proposed DLTMC structure can significantly reduce steady-state temperature compared with conventional structure of single layer rectangular micro-channel (SLRMC), the corresponding steady-state temperature for them can be reduced over 32.098 %. Besides, it is demonstrated that the steady-state temperature for MWCNT-water and SWCNT-water nanofluids as cooling liquids can be reduced by 22.490 % and 19.801 % than conventional water case, respectively. Moreover, it is manifested that the increase of bottom angle of DLTMC, volume concentration of nanofluid and flow velocity of cooling liquid can evidently improve heat transfer performance of 3D-ICs. Therefore, the presented results in this paper are beneficial for solving complex thermal problems of 3D-ICs.http://www.sciencedirect.com/science/article/pii/S2214157X24003940Three-dimensional integrated circuits (3D-ICs)Heat dissipation structureHeat transfer performanceDouble-layer triangular micro-channel (DLTMC)Computation thermal model |
| spellingShingle | Huan Huang Zong-jie Zeng Peng Xu The integration of double-layer triangular micro-channel in three-dimensional integrated circuits for enhancing heat transfer performance Case Studies in Thermal Engineering Three-dimensional integrated circuits (3D-ICs) Heat dissipation structure Heat transfer performance Double-layer triangular micro-channel (DLTMC) Computation thermal model |
| title | The integration of double-layer triangular micro-channel in three-dimensional integrated circuits for enhancing heat transfer performance |
| title_full | The integration of double-layer triangular micro-channel in three-dimensional integrated circuits for enhancing heat transfer performance |
| title_fullStr | The integration of double-layer triangular micro-channel in three-dimensional integrated circuits for enhancing heat transfer performance |
| title_full_unstemmed | The integration of double-layer triangular micro-channel in three-dimensional integrated circuits for enhancing heat transfer performance |
| title_short | The integration of double-layer triangular micro-channel in three-dimensional integrated circuits for enhancing heat transfer performance |
| title_sort | integration of double layer triangular micro channel in three dimensional integrated circuits for enhancing heat transfer performance |
| topic | Three-dimensional integrated circuits (3D-ICs) Heat dissipation structure Heat transfer performance Double-layer triangular micro-channel (DLTMC) Computation thermal model |
| url | http://www.sciencedirect.com/science/article/pii/S2214157X24003940 |
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