Chip Appearance Inspection Method for High-Precision SMT Equipment
In order to meet the defect-detection requirements of chips in high-precision surface mount technology (SMT) equipment widely used in the electronic industry, a chip appearance defect-detection method based on multi-order fractional discrete wavelet packet decomposition (DWPD) is proposed in this pa...
Main Authors: | , , |
---|---|
Format: | Article |
Language: | English |
Published: |
MDPI AG
2021-02-01
|
Series: | Machines |
Subjects: | |
Online Access: | https://www.mdpi.com/2075-1702/9/2/34 |