Interaction of Bis-(sodium-sulfopropyl)-Disulfide and Polyethylene Glycol on the Copper Electrodeposited Layer by Time-of-Flight Secondary-Ion Mass Spectrometry

Interaction of Bis-(sodium-sulfopropyl)-Disulfide and Polyethylene Glycol on the Copper Electrodeposited Layer by Time-of-Flight Secondary-Ion Mass Spectrometry

The interactions of the functional additives SPS (bis-(sodium-sulfopropyl)-disulfide) and polyethylene glycol (PEG) in the presence of chloride ions were studied by time-of-flight secondary-ion mass spectrometry (TOF-SIMS) in combination with cyclic voltammetry measurements (CV). The PEG, thiolate,...

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Bibliographic Details
Main Authors: Robert Mroczka, Agnieszka Słodkowska, Agata Ładniak, Agnieszka Chrzanowska
Format: Article
Language:English
Published: MDPI AG 2023-01-01
Series:Molecules
Subjects:
copper electrodeposition
SPS (bis-(sodium-sulfopropyl)-disulfide)
polyethylene glycol
TOF-SIMS
cyclic voltammetry
Online Access:https://www.mdpi.com/1420-3049/28/1/433

Internet

https://www.mdpi.com/1420-3049/28/1/433

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