Characterization of Cu-doped (Ni,Mn)3O4 thin films annealed at low temperatures
Negative-temperature coefficient of resistance (NTCR) thin films were prepared from (Ni0.2Mn2.8-xCux)Cl2 (0.010 ≤ x ≤ 0.040) solutions by liquid flow deposition (LFD) method. Influence of the Cu on the structural and electrical properties of the films annealed at °400°C was studied. It was found tha...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Taylor & Francis Group
2020-07-01
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| Series: | Journal of Asian Ceramic Societies |
| Subjects: | |
| Online Access: | http://dx.doi.org/10.1080/21870764.2020.1789290 |