Characterization of Cu-doped (Ni,Mn)3O4 thin films annealed at low temperatures

Characterization of Cu-doped (Ni,Mn)3O4 thin films annealed at low temperatures

Negative-temperature coefficient of resistance (NTCR) thin films were prepared from (Ni0.2Mn2.8-xCux)Cl2 (0.010 ≤ x ≤ 0.040) solutions by liquid flow deposition (LFD) method. Influence of the Cu on the structural and electrical properties of the films annealed at °400°C was studied. It was found tha...

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Bibliographic Details
Main Authors:	Duc Thang Le, Jeong Ho Cho, Heongkyu Ju
Format:	Article
Language:	English
Published:	Taylor & Francis Group 2020-07-01
Series:	Journal of Asian Ceramic Societies
Subjects:	liquid flow deposition thin films spinels nickel-copper-manganite solution process ir sensors
Online Access:	http://dx.doi.org/10.1080/21870764.2020.1789290

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