Effect of mechanical treatment type on the strength of undoped single crystal indium antimonide wafers
Thin (100) wafers of single crystal undoped InSb have been strength tested by plane transverse bending. The strength of the wafers (≤ 800 mm in thickness) has been shown to depend on their mechanical treatment type. If the full mechanical treatment cycle is used (grinding + chemical polishing) the s...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Pensoft Publishers
2020-12-01
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| Series: | Modern Electronic Materials |
| Online Access: | https://moem.pensoft.net/article/64991/download/pdf/ |