Effect of in Addition on Thermodynamic Properties, Wettability, Interface Microstructure, and Soldering Performance of SnBiAg–xIn/Cu Solder Joints
In this experiment, a Sn35Bi0.3Ag–xIn (x = 0, 0.5, 1.0, 1.5) alloy solder was prepared by electromagnetic induction heating furnace. The effects of In on the thermodynamic properties, wettability, interface microstructure, and soldering performance of Sn35Bi0.3Ag–xIn/Cu solder joints were studied by...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-09-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/12/10/1594 |