Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging

Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging

This study demonstrates room-temperature bonding using a getter layer for the vacuum packaging of microsystems. A thick Ti layer covered with an Au layer is utilized as a getter layer because it can absorb gas molecules in the package. Additionally, smooth Au surfaces can form direct bonds for herme...

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Bibliographic Details
Main Authors: Takashi Matsumae, Shingo Kariya, Yuichi Kurashima, Le Hac Huong Thu, Eiji Higurashi, Masanori Hayase, Hideki Takagi
Format: Article
Language:English
Published: MDPI AG 2022-10-01
Series:Sensors
Subjects:
wafer-scale packaging
room-temperature bonding
getter layer
template stripping
Online Access:https://www.mdpi.com/1424-8220/22/21/8144

Internet

https://www.mdpi.com/1424-8220/22/21/8144

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