Effect of Bi, Sb, and Ti on Microstructure and Mechanical Properties of SAC105 Alloys

Effect of Bi, Sb, and Ti on Microstructure and Mechanical Properties of SAC105 Alloys

The Sn-Ag-Cu (SAC) solder alloys with a low Ag (Ag < 3 wt.%) content have attracted great attention owing to their low cost, increased ability in bulk compliance, and plastic energy dissipation. However, some of their mechanical properties are generally lower than the SAC alloys with a higher Ag...

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Bibliographic Details
Main Authors: Tixin Yang, Youyang Chen, Kangdong You, Ziqiang Dong, Yandong Jia, Gang Wang, Jubo Peng, Shanshan Cai, Xiaobin Luo, Chen Liu, Jiajun Wang
Format: Article
Language:English
Published: MDPI AG 2022-07-01
Series:Materials
Subjects:
SAC solder
mechanical properties
microstructure
creep properties
Online Access:https://www.mdpi.com/1996-1944/15/14/4727

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https://www.mdpi.com/1996-1944/15/14/4727

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