Effect of Bi, Sb, and Ti on Microstructure and Mechanical Properties of SAC105 Alloys
The Sn-Ag-Cu (SAC) solder alloys with a low Ag (Ag < 3 wt.%) content have attracted great attention owing to their low cost, increased ability in bulk compliance, and plastic energy dissipation. However, some of their mechanical properties are generally lower than the SAC alloys with a higher Ag...
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2022-07-01
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| Online Access: | https://www.mdpi.com/1996-1944/15/14/4727 |
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| author | Tixin Yang Youyang Chen Kangdong You Ziqiang Dong Yandong Jia Gang Wang Jubo Peng Shanshan Cai Xiaobin Luo Chen Liu Jiajun Wang |
| author_facet | Tixin Yang Youyang Chen Kangdong You Ziqiang Dong Yandong Jia Gang Wang Jubo Peng Shanshan Cai Xiaobin Luo Chen Liu Jiajun Wang |
| author_sort | Tixin Yang |
| collection | DOAJ |
| description | The Sn-Ag-Cu (SAC) solder alloys with a low Ag (Ag < 3 wt.%) content have attracted great attention owing to their low cost, increased ability in bulk compliance, and plastic energy dissipation. However, some of their mechanical properties are generally lower than the SAC alloys with a higher Ag content. Adding alloying elements is an effective approach for improving the mechanical properties of the SAC alloys. In this study, the effect of Bi, Sb, and Ti on Sn-1 wt.%Ag-0.5 wt.%Cu (SAC105) solder alloys was investigated. The SAC solders with four compositions: SAC105-1 wt.%Bi, SAC105-1 wt.%Sb, SAC105-1 wt.%Bi-1 wt.%Sb, SAC105-1 wt.%Bi-1 wt.%Sb-0.4 wt.%Ti were prepared. The microstructure and phase compositions were characterized using electron scanning microscopy, and X-ray diffraction. The thermal properties and wettability were also examined. Uniaxial tensile tests and nano-indentation tests were conducted to evaluate the mechanical properties. The results show that adding Bi or Sb could increase the strength of SAC105 alloys mainly due to the solid solution strengthening effect. The creep resistance of SAC105 alloys was also improved with the additions of Bi and Sb. The co-additions of Bi and Sb into SAC105 alloys exhibit an enhanced creep resistance than that calculated by the theoretical calculation. The further addition of Ti into SAC105-1Bi-1Sb alloys demonstrated a much-improved creep resistance, which could be attributed to the synergistic effects of both solid solution strengthening and the precipitation hardening effects. |
| first_indexed | 2024-03-09T13:29:14Z |
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| id | doaj.art-6afe169e595645c2a27ffb3b0f4ed6e6 |
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| issn | 1996-1944 |
| language | English |
| last_indexed | 2024-03-09T13:29:14Z |
| publishDate | 2022-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Materials |
| spelling | doaj.art-6afe169e595645c2a27ffb3b0f4ed6e62023-11-30T21:19:41ZengMDPI AGMaterials1996-19442022-07-011514472710.3390/ma15144727Effect of Bi, Sb, and Ti on Microstructure and Mechanical Properties of SAC105 AlloysTixin Yang0Youyang Chen1Kangdong You2Ziqiang Dong3Yandong Jia4Gang Wang5Jubo Peng6Shanshan Cai7Xiaobin Luo8Chen Liu9Jiajun Wang10Materials Genome Insititute, Shanghai University, Shanghai 200444, ChinaMaterials Genome Insititute, Shanghai University, Shanghai 200444, ChinaMaterials Genome Insititute, Shanghai University, Shanghai 200444, ChinaMaterials Genome Insititute, Shanghai University, Shanghai 200444, ChinaInsititute of Materials, Shanghai University, Shanghai 200444, ChinaMaterials Genome Insititute, Shanghai University, Shanghai 200444, ChinaYunnan Tin Group (Holding) Co., Ltd., Kunming 650000, ChinaYunnan Tin Group (Holding) Co., Ltd., Kunming 650000, ChinaYunnan Tin Group (Holding) Co., Ltd., Kunming 650000, ChinaYunnan Tin Group (Holding) Co., Ltd., Kunming 650000, ChinaYunnan Tin Group (Holding) Co., Ltd., Kunming 650000, ChinaThe Sn-Ag-Cu (SAC) solder alloys with a low Ag (Ag < 3 wt.%) content have attracted great attention owing to their low cost, increased ability in bulk compliance, and plastic energy dissipation. However, some of their mechanical properties are generally lower than the SAC alloys with a higher Ag content. Adding alloying elements is an effective approach for improving the mechanical properties of the SAC alloys. In this study, the effect of Bi, Sb, and Ti on Sn-1 wt.%Ag-0.5 wt.%Cu (SAC105) solder alloys was investigated. The SAC solders with four compositions: SAC105-1 wt.%Bi, SAC105-1 wt.%Sb, SAC105-1 wt.%Bi-1 wt.%Sb, SAC105-1 wt.%Bi-1 wt.%Sb-0.4 wt.%Ti were prepared. The microstructure and phase compositions were characterized using electron scanning microscopy, and X-ray diffraction. The thermal properties and wettability were also examined. Uniaxial tensile tests and nano-indentation tests were conducted to evaluate the mechanical properties. The results show that adding Bi or Sb could increase the strength of SAC105 alloys mainly due to the solid solution strengthening effect. The creep resistance of SAC105 alloys was also improved with the additions of Bi and Sb. The co-additions of Bi and Sb into SAC105 alloys exhibit an enhanced creep resistance than that calculated by the theoretical calculation. The further addition of Ti into SAC105-1Bi-1Sb alloys demonstrated a much-improved creep resistance, which could be attributed to the synergistic effects of both solid solution strengthening and the precipitation hardening effects.https://www.mdpi.com/1996-1944/15/14/4727SAC soldermechanical propertiesmicrostructurecreep properties |
| spellingShingle | Tixin Yang Youyang Chen Kangdong You Ziqiang Dong Yandong Jia Gang Wang Jubo Peng Shanshan Cai Xiaobin Luo Chen Liu Jiajun Wang Effect of Bi, Sb, and Ti on Microstructure and Mechanical Properties of SAC105 Alloys Materials SAC solder mechanical properties microstructure creep properties |
| title | Effect of Bi, Sb, and Ti on Microstructure and Mechanical Properties of SAC105 Alloys |
| title_full | Effect of Bi, Sb, and Ti on Microstructure and Mechanical Properties of SAC105 Alloys |
| title_fullStr | Effect of Bi, Sb, and Ti on Microstructure and Mechanical Properties of SAC105 Alloys |
| title_full_unstemmed | Effect of Bi, Sb, and Ti on Microstructure and Mechanical Properties of SAC105 Alloys |
| title_short | Effect of Bi, Sb, and Ti on Microstructure and Mechanical Properties of SAC105 Alloys |
| title_sort | effect of bi sb and ti on microstructure and mechanical properties of sac105 alloys |
| topic | SAC solder mechanical properties microstructure creep properties |
| url | https://www.mdpi.com/1996-1944/15/14/4727 |
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