Lightweight diamond/Cu interface tuning for outstanding heat conduction
Abstract With rapid developments in the field of very large‐scale integrated circuits, heat dissipation has emerged as a significant factor that restricts the high‐density integration of chips. Due to their high thermal conductivity and low thermal expansion coefficient, diamond/Cu composites have a...
| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2023-12-01
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| Series: | Carbon Energy |
| Subjects: | |
| Online Access: | https://doi.org/10.1002/cey2.379 |