Lightweight diamond/Cu interface tuning for outstanding heat conduction
Abstract With rapid developments in the field of very large‐scale integrated circuits, heat dissipation has emerged as a significant factor that restricts the high‐density integration of chips. Due to their high thermal conductivity and low thermal expansion coefficient, diamond/Cu composites have a...
| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
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Wiley
2023-12-01
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| Series: | Carbon Energy |
| Subjects: | |
| Online Access: | https://doi.org/10.1002/cey2.379 |
| _version_ | 1797371838870847488 |
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| author | Wenjie Dou Congxu Zhu Xiwang Wu Xun Yang Wenjun Fa Yange Zhang Junfeng Tong Guangshan Zhu Zhi Zheng |
| author_facet | Wenjie Dou Congxu Zhu Xiwang Wu Xun Yang Wenjun Fa Yange Zhang Junfeng Tong Guangshan Zhu Zhi Zheng |
| author_sort | Wenjie Dou |
| collection | DOAJ |
| description | Abstract With rapid developments in the field of very large‐scale integrated circuits, heat dissipation has emerged as a significant factor that restricts the high‐density integration of chips. Due to their high thermal conductivity and low thermal expansion coefficient, diamond/Cu composites have attracted considerable attention as a promising thermal management material. In this study, a surface tungsten carbide gradient layer coating of diamond particles has been realized using comprehensive magnetron sputtering technology and a heat treatment process. Diamond/Cu composites were prepared using high‐temperature and high‐pressure technology. The results show that, by adjusting the heat treatment process, tungsten carbide and di‐tungsten carbide are generated by an in situ reaction at the tungsten–diamond interface, and W–WC–W2C gradient layer‐coated diamond particles were obtained. The diamond/Cu composites were sintered by high‐temperature and high‐pressure technology, and the density of surface‐modified diamond/Cu composites was less than 4 g cm−3. The W–WC–W2C@diamond/Cu composites have a thermal diffusivity as high as 331 mm2 s−1, and their thermal expansion coefficient is as low as 1.76 × 10−6 K−1. The interface coherent structure of the gradient layer‐coated diamond/copper composite can effectively improve the interface heat transport efficiency. |
| first_indexed | 2024-03-08T18:27:42Z |
| format | Article |
| id | doaj.art-6bdd6d3fa6914edfa3a737810a9b7091 |
| institution | Directory Open Access Journal |
| issn | 2637-9368 |
| language | English |
| last_indexed | 2024-03-08T18:27:42Z |
| publishDate | 2023-12-01 |
| publisher | Wiley |
| record_format | Article |
| series | Carbon Energy |
| spelling | doaj.art-6bdd6d3fa6914edfa3a737810a9b70912023-12-30T10:32:33ZengWileyCarbon Energy2637-93682023-12-01512n/an/a10.1002/cey2.379Lightweight diamond/Cu interface tuning for outstanding heat conductionWenjie Dou0Congxu Zhu1Xiwang Wu2Xun Yang3Wenjun Fa4Yange Zhang5Junfeng Tong6Guangshan Zhu7Zhi Zheng8Henan Key Laboratory of Diamond Optoelectronic Materials and Devices, Key Laboratory of Materials Physics, Ministry of Education, School of Physics and Microelectronics Zhengzhou University Zhengzhou ChinaKey Laboratory of Micro‐Nano Materials for Energy Storage and Conversion of Henan Province, College of Chemical and Materials Engineering Xuchang University Xuchang ChinaKey Laboratory of Micro‐Nano Materials for Energy Storage and Conversion of Henan Province, College of Chemical and Materials Engineering Xuchang University Xuchang ChinaHenan Key Laboratory of Diamond Optoelectronic Materials and Devices, Key Laboratory of Materials Physics, Ministry of Education, School of Physics and Microelectronics Zhengzhou University Zhengzhou ChinaKey Laboratory of Micro‐Nano Materials for Energy Storage and Conversion of Henan Province, College of Chemical and Materials Engineering Xuchang University Xuchang ChinaKey Laboratory of Micro‐Nano Materials for Energy Storage and Conversion of Henan Province, College of Chemical and Materials Engineering Xuchang University Xuchang ChinaWork‐Station of Zhongyuan Scholars of Henan Province, Henan Huanghe Whirlwind Co. Ltd. Changge ChinaKey Laboratory of Polyoxometalate and Reticular Material Chemistry of Ministry of Education Northeast Normal University Changchun ChinaKey Laboratory of Micro‐Nano Materials for Energy Storage and Conversion of Henan Province, College of Chemical and Materials Engineering Xuchang University Xuchang ChinaAbstract With rapid developments in the field of very large‐scale integrated circuits, heat dissipation has emerged as a significant factor that restricts the high‐density integration of chips. Due to their high thermal conductivity and low thermal expansion coefficient, diamond/Cu composites have attracted considerable attention as a promising thermal management material. In this study, a surface tungsten carbide gradient layer coating of diamond particles has been realized using comprehensive magnetron sputtering technology and a heat treatment process. Diamond/Cu composites were prepared using high‐temperature and high‐pressure technology. The results show that, by adjusting the heat treatment process, tungsten carbide and di‐tungsten carbide are generated by an in situ reaction at the tungsten–diamond interface, and W–WC–W2C gradient layer‐coated diamond particles were obtained. The diamond/Cu composites were sintered by high‐temperature and high‐pressure technology, and the density of surface‐modified diamond/Cu composites was less than 4 g cm−3. The W–WC–W2C@diamond/Cu composites have a thermal diffusivity as high as 331 mm2 s−1, and their thermal expansion coefficient is as low as 1.76 × 10−6 K−1. The interface coherent structure of the gradient layer‐coated diamond/copper composite can effectively improve the interface heat transport efficiency.https://doi.org/10.1002/cey2.379coherent interfacediamond compositeheat conductionsurface modification |
| spellingShingle | Wenjie Dou Congxu Zhu Xiwang Wu Xun Yang Wenjun Fa Yange Zhang Junfeng Tong Guangshan Zhu Zhi Zheng Lightweight diamond/Cu interface tuning for outstanding heat conduction Carbon Energy coherent interface diamond composite heat conduction surface modification |
| title | Lightweight diamond/Cu interface tuning for outstanding heat conduction |
| title_full | Lightweight diamond/Cu interface tuning for outstanding heat conduction |
| title_fullStr | Lightweight diamond/Cu interface tuning for outstanding heat conduction |
| title_full_unstemmed | Lightweight diamond/Cu interface tuning for outstanding heat conduction |
| title_short | Lightweight diamond/Cu interface tuning for outstanding heat conduction |
| title_sort | lightweight diamond cu interface tuning for outstanding heat conduction |
| topic | coherent interface diamond composite heat conduction surface modification |
| url | https://doi.org/10.1002/cey2.379 |
| work_keys_str_mv | AT wenjiedou lightweightdiamondcuinterfacetuningforoutstandingheatconduction AT congxuzhu lightweightdiamondcuinterfacetuningforoutstandingheatconduction AT xiwangwu lightweightdiamondcuinterfacetuningforoutstandingheatconduction AT xunyang lightweightdiamondcuinterfacetuningforoutstandingheatconduction AT wenjunfa lightweightdiamondcuinterfacetuningforoutstandingheatconduction AT yangezhang lightweightdiamondcuinterfacetuningforoutstandingheatconduction AT junfengtong lightweightdiamondcuinterfacetuningforoutstandingheatconduction AT guangshanzhu lightweightdiamondcuinterfacetuningforoutstandingheatconduction AT zhizheng lightweightdiamondcuinterfacetuningforoutstandingheatconduction |