Impact of surface texture on ultrasonic wire bonding process

Impact of surface texture on ultrasonic wire bonding process

Due to the complex mechanisms, the ultrasonic (US) wire bonding process is usually optimized in the way of varying the processing parameters including normal force, US power, and processing time. In this study, a new way by creating different surface textures on substrates was used to alter the bond...

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Bibliographic Details
Main Authors: Yangyang Long, Matthias Arndt, Folke Dencker, Marc Wurz, Jens Twiefel, Jörg Wallaschek
Format: Article
Language:English
Published: Elsevier 2022-09-01
Series:Journal of Materials Research and Technology
Subjects:
Ultrasonic wire bonding
Surface texture
Oxide removal
Microweld formation
Bonding mechanisms
Process window
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785422012005

Internet

http://www.sciencedirect.com/science/article/pii/S2238785422012005

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