High current density 1.2 kV class HfO2-gated vertical GaN trench MOSFETs

This work reports on high current density 1.2 kV class HfO _2 -gated vertical GaN trench metal-oxide-semiconductor field-effect transistors (MOSFETs). An output current density of 330 mA mm ^−1 is reported at a drain bias of five volts, which, to our knowledge, is over ten-times the highest reported...

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Bibliographic Details
Main Authors: Andrew T. Binder, Jeffrey Steinfeldt, Kevin J. Reilly, Richard S. Floyd, Peter T. Dickens, Joseph P. Klesko, Andrew A. Allerman, Robert J. Kaplar
Format: Article
Language:English
Published: IOP Publishing 2024-01-01
Series:Applied Physics Express
Subjects:
Online Access:https://doi.org/10.35848/1882-0786/ad85c1
Description
Summary:This work reports on high current density 1.2 kV class HfO _2 -gated vertical GaN trench metal-oxide-semiconductor field-effect transistors (MOSFETs). An output current density of 330 mA mm ^−1 is reported at a drain bias of five volts, which, to our knowledge, is over ten-times the highest reported values for 1.2 kV class GaN or SiC MOSFETs. This work also showcases a significant achievement in demonstrating substantially thick (100 nm) HfO _2 on GaN with simultaneous low leakage current (0.5 nA at 2 MV cm ^−1 ), a high breakdown strength (5.2 MV cm ^−1 ), and a high recorded dielectric constant (22.0).
ISSN:1882-0786