High-frequency 5G substrate: Low dielectric biphenyl polyimide with low CTE and high thermal stability

High-frequency 5G substrate: Low dielectric biphenyl polyimide with low CTE and high thermal stability

Polyimide (PI) faces new challenges in meeting the requirements of low coefficient of thermal expansion (CTE), low dielectric content/loss, and high thermal stability to be utilized effectively as a substrate for flexible electronic materials. At present research, the CTE of PI films can be reduced...

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Bibliographic Details
Main Authors: Heming Li, Panpeng Wei, Yongqi Wang, Qiushi Zhu, Xinming Wang, Weiguo Gao, Lin Tao, Ke Ma, Zhizhi Hu, Wei Chen
Format: Article
Language:English
Published: Elsevier 2024-08-01
Series:Materials Today Advances
Subjects:
Biphenyl polyimide
Thermal expansion
Thermal stability
Dielectric property
5G Substrate
Online Access:http://www.sciencedirect.com/science/article/pii/S2590049824000511

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http://www.sciencedirect.com/science/article/pii/S2590049824000511

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