A Numerical Investigation on Hydrothermal Performance of Micro Channel Heat Sink with Periodic Spatial Modification on Sidewalls

A Numerical Investigation on Hydrothermal Performance of Micro Channel Heat Sink with Periodic Spatial Modification on Sidewalls

Electronic gadgets have been designed to incorporating very small components such as microcontrollers, electronic chips, transistors, microprocessors, etc. These components are exceptionally heat sensitive and can be wrecked if heat is not released. As a result, the thermal control of such component...

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Bibliographic Details
Main Authors: Nikita Kumari, Tabish Alam, Masood Ashraf Ali, Anil Singh Yadav, Naveen Kumar Gupta, Md Irfanul Haque Siddiqui, Dan Dobrotă, Ionela Magdalena Rotaru, Abhishek Sharma
Format: Article
Language:English
Published: MDPI AG 2022-11-01
Series:Micromachines
Subjects:
microchannel heat sink (MCHS)
hydrothermal performance
thermal resistance
Nusselt number
Online Access:https://www.mdpi.com/2072-666X/13/11/1986

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https://www.mdpi.com/2072-666X/13/11/1986

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