A Direct n<sup>+</sup>-Formation Process by Magnetron Sputtering an Inter-Layer Dielectric for Self-Aligned Coplanar Indium Gallium Zinc Oxide Thin-Film Transistors

An inter-layer dielectric (ILD) deposition process to simultaneously form the conductive regions of self-aligned (SA) coplanar In-Ga-Zn-O (IGZO) thin-film transistors (TFTs) is demonstrated. N<sup>+</sup>-IGZO regions and excellent ohmic contact can be obtained without additional steps b...

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Bibliographic Details
Main Authors: Xinlv Duan, Congyan Lu, Xichen Chuai, Qian Chen, Guanhua Yang, Di Geng
Format: Article
Language:English
Published: MDPI AG 2022-04-01
Series:Micromachines
Subjects:
Online Access:https://www.mdpi.com/2072-666X/13/5/652
Description
Summary:An inter-layer dielectric (ILD) deposition process to simultaneously form the conductive regions of self-aligned (SA) coplanar In-Ga-Zn-O (IGZO) thin-film transistors (TFTs) is demonstrated. N<sup>+</sup>-IGZO regions and excellent ohmic contact can be obtained without additional steps by using a magnetron sputtering process to deposit a SiO<sub>x</sub> ILD. The fabricated IGZO TFTs show a subthreshold swing (SS) of 94.16 mV/decade and a linear-region field-effect mobility (<i>μ<sub>FE</sub></i>) of 23.06 cm<sup>2</sup>/Vs. The channel-width-normalized source/drain series resistance (<i>R<sub>SD</sub>W</i>) extracted using the transmission line method (TLM) is approximately as low as 9.4 Ω·cm. The fabricated ring oscillator (RO) with a maximum oscillation frequency of 1.75 MHz also verifies the applicability of the TFTs.
ISSN:2072-666X