Thermal Testing and System Reliability: Transferring Thermal Interactions by Heat Conduction through a Peltier-Based Thermal Coupling System
Testing and reliability assessment are crucial aspects when considering the thermal domain’s influence on the overall system. Thermal interactions occur between all subsystems, and their separation can disrupt internal thermal interactions, altering temperature profiles. Evaluating functional system...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-02-01
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| Series: | Energies |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1073/17/5/1127 |