A critique of the approach to controlling electrostatic risk in semiconductor production and identification of a potential risk from the use of equipotential bonding

A critique of the approach to controlling electrostatic risk in semiconductor production and identification of a potential risk from the use of equipotential bonding

Equipotential bonding, whereby objects are connected to a common electrical potential (usually ground) to prevent electrostatic discharges during material handling, has been shown to increase the risk of field-induced reticle damage. It is explained how the presence of an electric field can cause el...

書誌詳細
第一著者:	Gavin C Rider
フォーマット:	論文
言語:	English
出版事項:	AIMS Press 2019-01-01
シリーズ:	AIMS Electronics and Electrical Engineering
主題:	esd efm esds ees field induction device damage equipotential bonding grounding
オンライン･アクセス:	https://www.aimspress.com/article/10.3934/ElectrEng.2019.4.397/fulltext.html

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