Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere

Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere

Formic acid (FA) atmosphere is promising to achieve chemical reduction at the oxidized surfaces of the solder and matrix material during soldering, replacing chemical flux being challenging as the continuous decrease in the pitch of solder bump in a three-dimensional integrated circuit. Although a p...

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Bibliographic Details
Main Authors: Siliang He, Yu-An Shen, Bifu Xiong, Fupeng Huo, Jiahui Li, Jinguo Ge, Zhiliang Pan, Wangyun Li, Chuan Hu, Hiroshi Nishikawa
Format: Article
Language:English
Published: Elsevier 2022-11-01
Series:Journal of Materials Research and Technology
Subjects:
Soldering
Intermetallic compound
Fluxless
Formic acid
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785422015952

Internet

http://www.sciencedirect.com/science/article/pii/S2238785422015952

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