A Self-Training-Based System for Die Defect Classification

A Self-Training-Based System for Die Defect Classification

With increasing wafer sizes and diversifying die patterns, automated optical inspection (AOI) is progressively replacing traditional visual inspection (VI) for wafer defect detection. Yet, the defect classification efficacy of current AOI systems in our case company is not optimal. This limitation i...

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Bibliographic Details
Main Authors: Ping-Hung Wu, Siou-Zih Lin, Yuan-Teng Chang, Yu-Wei Lai, Ssu-Han Chen
Format: Article
Language:English
Published: MDPI AG 2024-08-01
Series:Mathematics
Subjects:
semi-supervised learning
self-training
die defect classification
Online Access:https://www.mdpi.com/2227-7390/12/15/2415

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https://www.mdpi.com/2227-7390/12/15/2415

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