A thermal network model considering thermal coupling effect and TIM degradation in IGBT modules

A thermal network model considering thermal coupling effect and TIM degradation in IGBT modules

Thermal interface materials (TIMs), as important materials for heat dissipation of insulated gate bipolar transistor (IGBT) modules, degrade under long-term thermal cycling, resulting in elevated junction temperatures and threatening the safe operation of IGBT modules. In consideration of the therma...

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Bibliographic Details
Main Authors: Xiaotong Zhang, Zhuolin Cheng, Chunlin Lv, Xing Sun, Jianying Li, Kangning Wu
Format: Article
Language:English
Published: Elsevier 2023-10-01
Series:Energy Reports
Subjects:
Thermal network
Thermal interface material
IGBT module
Junction temperature calculation
FEM simulation
Online Access:http://www.sciencedirect.com/science/article/pii/S2352484723009393

Internet

http://www.sciencedirect.com/science/article/pii/S2352484723009393

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