Adhesion property between low-thermal-expansion poly(benzoxazole-imide) film and ion-implanted copper

Adhesion property between low-thermal-expansion poly(benzoxazole-imide) film and ion-implanted copper

Surface modification of poly(benzoxazole-imide) (PI) film was carried out by means of oxygen plasma treatment. A flexible copper clad laminate (FCCL) was fabricated using Ni-Cr ion implantation and electro-Cu plating process. Controlling the constant pressure, the effects of such treatment condition...

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Bibliographic Details
Main Authors: CUI Chao, YUAN Lili, YIN Liang, HUANG Yudong, MENG Linghui, YANG Nianqun, YANG Shiyong
Format: Article
Language:zho
Published: Journal of Materials Engineering 2022-10-01
Series:Cailiao gongcheng
Subjects:
benzoxazole
polyimide
ion implantation
flexible cupper clad laminate
peel strength
Online Access:http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2021.001095

Internet

http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2021.001095

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