Two-Stage Leaching of PCBs Using Sulfuric and Nitric Acid with the Addition of Hydrogen Peroxide and Ozone

Two-Stage Leaching of PCBs Using Sulfuric and Nitric Acid with the Addition of Hydrogen Peroxide and Ozone

The paper presents the possibility of recovering metals from printed circuit boards (PCBs) of spent mobile phones using the hydrometallurgical method. Two-stage leaching of Cu(II), Fe(III), Sn(IV), Zn(II), Ni(II) and Pb(II) with H<sub>2</sub>SO<sub>4</sub> (2 and 5 M) and HNO...

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Bibliographic Details
Main Authors: Magdalena Lisińska, Tomasz Wojtal, Mariola Saternus, Joanna Willner, Martyna Rzelewska-Piekut, Krzysztof Nowacki
Format: Article
Language:English
Published: MDPI AG 2023-12-01
Series:Materials
Subjects:
hydrometallurgy
PCB
metal recovery
acids
hydrogen peroxide
ozone
Online Access:https://www.mdpi.com/1996-1944/17/1/219

Internet

https://www.mdpi.com/1996-1944/17/1/219

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