Two-Stage Leaching of PCBs Using Sulfuric and Nitric Acid with the Addition of Hydrogen Peroxide and Ozone
The paper presents the possibility of recovering metals from printed circuit boards (PCBs) of spent mobile phones using the hydrometallurgical method. Two-stage leaching of Cu(II), Fe(III), Sn(IV), Zn(II), Ni(II) and Pb(II) with H<sub>2</sub>SO<sub>4</sub> (2 and 5 M) and HNO...
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2023-12-01
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| Online Access: | https://www.mdpi.com/1996-1944/17/1/219 |
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| author | Magdalena Lisińska Tomasz Wojtal Mariola Saternus Joanna Willner Martyna Rzelewska-Piekut Krzysztof Nowacki |
| author_facet | Magdalena Lisińska Tomasz Wojtal Mariola Saternus Joanna Willner Martyna Rzelewska-Piekut Krzysztof Nowacki |
| author_sort | Magdalena Lisińska |
| collection | DOAJ |
| description | The paper presents the possibility of recovering metals from printed circuit boards (PCBs) of spent mobile phones using the hydrometallurgical method. Two-stage leaching of Cu(II), Fe(III), Sn(IV), Zn(II), Ni(II) and Pb(II) with H<sub>2</sub>SO<sub>4</sub> (2 and 5 M) and HNO<sub>3</sub> (2 M) with the addition of H<sub>2</sub>O<sub>2</sub> (10 and 30%) and O<sub>3</sub> (9 or 15 g/h) was conducted at various process conditions (temperature—313, 333 and 353 K, time—60, 120, 240, 300 min, type and concentration of leaching agent, type and concentration of oxidant, solid–liquid ratio (S/L)), allowing for a high or total metals leaching rate. The use of two leaching stages allows for the preservation of selectivity, separation and recovery of metals: in the first stage of Fe(III), Sn(IV) and in the second stage of the remaining tested metal ions, i.e., Cu(II), Zn(II), Ni(II) and Pb(II). Removing Fe from the tested PCBs’ material at the beginning of the process eliminates the need to use magnetic methods, the purpose of which is to separate magnetic metal particles (ferrous) from non-magnetic (non-ferrous) particles; these procedures involve high operating costs. Since the leaching of Cu(II) ions with sulfuric(VI) acid practically does not occur (less than 1%), this allows for almost complete transfer of these ions into the solution in the second stage of leaching. Moreover, to speed up the process and not generate too many waste solutions, oxidants in the form of hydrogen peroxide and ozone were used. The best degree of leaching of all tested metal ions was obtained when 2 M sulfuric(VI) acid at 353 K was used in the 1st research stage, and 2 M nitric(V) acid and 9 g/h O<sub>3</sub> at 298 K in the 2nd stage of leaching, which allowed it to be totally leached 100% of Fe(III), Cu(II), Sn(IV), Zn(II), Ni(II) and 90% Pb(II). |
| first_indexed | 2024-03-08T15:02:27Z |
| format | Article |
| id | doaj.art-717b7d6a50094a85bdfbe42320706dd5 |
| institution | Directory Open Access Journal |
| issn | 1996-1944 |
| language | English |
| last_indexed | 2024-03-08T15:02:27Z |
| publishDate | 2023-12-01 |
| publisher | MDPI AG |
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| spelling | doaj.art-717b7d6a50094a85bdfbe42320706dd52024-01-10T15:03:01ZengMDPI AGMaterials1996-19442023-12-0117121910.3390/ma17010219Two-Stage Leaching of PCBs Using Sulfuric and Nitric Acid with the Addition of Hydrogen Peroxide and OzoneMagdalena Lisińska0Tomasz Wojtal1Mariola Saternus2Joanna Willner3Martyna Rzelewska-Piekut4Krzysztof Nowacki5Zakłady Mechaniczne „WIROMET” S.A., ul. Wyzwolenia 27, 43-190 Mikołów, PolandFaculty of Materials Engineering, Silesian University of Technology, ul. Krasińskiego 8, 40-019 Katowice, PolandFaculty of Materials Engineering, Silesian University of Technology, ul. Krasińskiego 8, 40-019 Katowice, PolandFaculty of Materials Engineering, Silesian University of Technology, ul. Krasińskiego 8, 40-019 Katowice, PolandInstitute of Chemical Technology and Engineering, Poznan University of Technology, ul. Berdychowo 4, 60-965 Poznan, PolandFaculty of Materials Engineering, Silesian University of Technology, ul. Krasińskiego 8, 40-019 Katowice, PolandThe paper presents the possibility of recovering metals from printed circuit boards (PCBs) of spent mobile phones using the hydrometallurgical method. Two-stage leaching of Cu(II), Fe(III), Sn(IV), Zn(II), Ni(II) and Pb(II) with H<sub>2</sub>SO<sub>4</sub> (2 and 5 M) and HNO<sub>3</sub> (2 M) with the addition of H<sub>2</sub>O<sub>2</sub> (10 and 30%) and O<sub>3</sub> (9 or 15 g/h) was conducted at various process conditions (temperature—313, 333 and 353 K, time—60, 120, 240, 300 min, type and concentration of leaching agent, type and concentration of oxidant, solid–liquid ratio (S/L)), allowing for a high or total metals leaching rate. The use of two leaching stages allows for the preservation of selectivity, separation and recovery of metals: in the first stage of Fe(III), Sn(IV) and in the second stage of the remaining tested metal ions, i.e., Cu(II), Zn(II), Ni(II) and Pb(II). Removing Fe from the tested PCBs’ material at the beginning of the process eliminates the need to use magnetic methods, the purpose of which is to separate magnetic metal particles (ferrous) from non-magnetic (non-ferrous) particles; these procedures involve high operating costs. Since the leaching of Cu(II) ions with sulfuric(VI) acid practically does not occur (less than 1%), this allows for almost complete transfer of these ions into the solution in the second stage of leaching. Moreover, to speed up the process and not generate too many waste solutions, oxidants in the form of hydrogen peroxide and ozone were used. The best degree of leaching of all tested metal ions was obtained when 2 M sulfuric(VI) acid at 353 K was used in the 1st research stage, and 2 M nitric(V) acid and 9 g/h O<sub>3</sub> at 298 K in the 2nd stage of leaching, which allowed it to be totally leached 100% of Fe(III), Cu(II), Sn(IV), Zn(II), Ni(II) and 90% Pb(II).https://www.mdpi.com/1996-1944/17/1/219hydrometallurgyPCBmetal recoveryacidshydrogen peroxideozone |
| spellingShingle | Magdalena Lisińska Tomasz Wojtal Mariola Saternus Joanna Willner Martyna Rzelewska-Piekut Krzysztof Nowacki Two-Stage Leaching of PCBs Using Sulfuric and Nitric Acid with the Addition of Hydrogen Peroxide and Ozone Materials hydrometallurgy PCB metal recovery acids hydrogen peroxide ozone |
| title | Two-Stage Leaching of PCBs Using Sulfuric and Nitric Acid with the Addition of Hydrogen Peroxide and Ozone |
| title_full | Two-Stage Leaching of PCBs Using Sulfuric and Nitric Acid with the Addition of Hydrogen Peroxide and Ozone |
| title_fullStr | Two-Stage Leaching of PCBs Using Sulfuric and Nitric Acid with the Addition of Hydrogen Peroxide and Ozone |
| title_full_unstemmed | Two-Stage Leaching of PCBs Using Sulfuric and Nitric Acid with the Addition of Hydrogen Peroxide and Ozone |
| title_short | Two-Stage Leaching of PCBs Using Sulfuric and Nitric Acid with the Addition of Hydrogen Peroxide and Ozone |
| title_sort | two stage leaching of pcbs using sulfuric and nitric acid with the addition of hydrogen peroxide and ozone |
| topic | hydrometallurgy PCB metal recovery acids hydrogen peroxide ozone |
| url | https://www.mdpi.com/1996-1944/17/1/219 |
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