MICROSTRUCTURE AND INTERFACIAL INTERMETALLIC OF Sn-3.0Ag-0.5Cu/Sn-58Bi SOLDER JOINT FOR PACKAGE-ON-PACKAGE TECHNOLOGY
In this study, the effect of growth microstructure on diffusion and intermetallic compound of Sn-58Bi/SAC305 solder joint with different of SAC305 size and reflow temperature had been studied. For effect of different size, it used 180°C reflow temperature and 5minute reflow time with the size of SAC...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Politehnium Publishing House
2023-06-01
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| Series: | European Journal of Materials Science and Engineering |
| Subjects: | |
| Online Access: | https://ejmse.ro/articles/08_02_01_EJMSE-22-164.pdf |