MICROSTRUCTURE AND INTERFACIAL INTERMETALLIC OF Sn-3.0Ag-0.5Cu/Sn-58Bi SOLDER JOINT FOR PACKAGE-ON-PACKAGE TECHNOLOGY
In this study, the effect of growth microstructure on diffusion and intermetallic compound of Sn-58Bi/SAC305 solder joint with different of SAC305 size and reflow temperature had been studied. For effect of different size, it used 180°C reflow temperature and 5minute reflow time with the size of SAC...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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Politehnium Publishing House
2023-06-01
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| Series: | European Journal of Materials Science and Engineering |
| Subjects: | |
| Online Access: | https://ejmse.ro/articles/08_02_01_EJMSE-22-164.pdf |
| _version_ | 1797681587670745088 |
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| author | Mohd Izrul Izwan RAMLI Rita MOHD SAID Flora SOMIDIN Siti Farahnabilah MUHD AMLI Siti Nor Atirah MUSTAPHA |
| author_facet | Mohd Izrul Izwan RAMLI Rita MOHD SAID Flora SOMIDIN Siti Farahnabilah MUHD AMLI Siti Nor Atirah MUSTAPHA |
| author_sort | Mohd Izrul Izwan RAMLI |
| collection | DOAJ |
| description | In this study, the effect of growth microstructure on diffusion and intermetallic compound of Sn-58Bi/SAC305 solder joint with different of SAC305 size and reflow temperature had been studied. For effect of different size, it used 180°C reflow temperature and 5minute reflow time with the size of SAC305 solder ball was 800μm, 900μm and 1000μm. For the reflow temperature would reflow at 160°C,170°C, 180°C, and 190°C for 5minute reflow time. After the reflow process, a sample would go through a several processes such as molding, grinding and polishing before undergoing material characterization. The diffusion area had shown an inversely relationship with SAC305 size and linearly relationship with temperature and time reflow. Besides, the IMC thickness was thinner with increasing of SAC305 size. In this finding, the area of Sn-58Bi/SAC305 solder joint could be predicted to enhance the package on package technology. |
| first_indexed | 2024-03-11T23:47:05Z |
| format | Article |
| id | doaj.art-717cf962b6d3437b83827c282c088d54 |
| institution | Directory Open Access Journal |
| issn | 2537-4338 2537-4346 |
| language | English |
| last_indexed | 2024-03-11T23:47:05Z |
| publishDate | 2023-06-01 |
| publisher | Politehnium Publishing House |
| record_format | Article |
| series | European Journal of Materials Science and Engineering |
| spelling | doaj.art-717cf962b6d3437b83827c282c088d542023-09-19T09:14:16ZengPolitehnium Publishing HouseEuropean Journal of Materials Science and Engineering2537-43382537-43462023-06-0182697310.36868/ejmse.2023.08.02.069MICROSTRUCTURE AND INTERFACIAL INTERMETALLIC OF Sn-3.0Ag-0.5Cu/Sn-58Bi SOLDER JOINT FOR PACKAGE-ON-PACKAGE TECHNOLOGYMohd Izrul Izwan RAMLI0Rita MOHD SAID1Flora SOMIDIN2Siti Farahnabilah MUHD AMLI3 Siti Nor Atirah MUSTAPHA4Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP), Perlis 02600, Malaysia Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP), Perlis 02600, Malaysia Geopolymer & Green Technology, Center of Excellence (CEGeoGTech), Universiti Malaysia Perlis (UniMAP), Perlis 02600, MalaysiaFaculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP), Perlis 02600, Malaysia 1Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP), Perlis 02600, MalaysiaIn this study, the effect of growth microstructure on diffusion and intermetallic compound of Sn-58Bi/SAC305 solder joint with different of SAC305 size and reflow temperature had been studied. For effect of different size, it used 180°C reflow temperature and 5minute reflow time with the size of SAC305 solder ball was 800μm, 900μm and 1000μm. For the reflow temperature would reflow at 160°C,170°C, 180°C, and 190°C for 5minute reflow time. After the reflow process, a sample would go through a several processes such as molding, grinding and polishing before undergoing material characterization. The diffusion area had shown an inversely relationship with SAC305 size and linearly relationship with temperature and time reflow. Besides, the IMC thickness was thinner with increasing of SAC305 size. In this finding, the area of Sn-58Bi/SAC305 solder joint could be predicted to enhance the package on package technology.https://ejmse.ro/articles/08_02_01_EJMSE-22-164.pdfpackage on packagelow-temperature soldersn-58biinterfacial intermetallic |
| spellingShingle | Mohd Izrul Izwan RAMLI Rita MOHD SAID Flora SOMIDIN Siti Farahnabilah MUHD AMLI Siti Nor Atirah MUSTAPHA MICROSTRUCTURE AND INTERFACIAL INTERMETALLIC OF Sn-3.0Ag-0.5Cu/Sn-58Bi SOLDER JOINT FOR PACKAGE-ON-PACKAGE TECHNOLOGY European Journal of Materials Science and Engineering package on package low-temperature solder sn-58bi interfacial intermetallic |
| title | MICROSTRUCTURE AND INTERFACIAL INTERMETALLIC OF Sn-3.0Ag-0.5Cu/Sn-58Bi SOLDER JOINT FOR PACKAGE-ON-PACKAGE TECHNOLOGY |
| title_full | MICROSTRUCTURE AND INTERFACIAL INTERMETALLIC OF Sn-3.0Ag-0.5Cu/Sn-58Bi SOLDER JOINT FOR PACKAGE-ON-PACKAGE TECHNOLOGY |
| title_fullStr | MICROSTRUCTURE AND INTERFACIAL INTERMETALLIC OF Sn-3.0Ag-0.5Cu/Sn-58Bi SOLDER JOINT FOR PACKAGE-ON-PACKAGE TECHNOLOGY |
| title_full_unstemmed | MICROSTRUCTURE AND INTERFACIAL INTERMETALLIC OF Sn-3.0Ag-0.5Cu/Sn-58Bi SOLDER JOINT FOR PACKAGE-ON-PACKAGE TECHNOLOGY |
| title_short | MICROSTRUCTURE AND INTERFACIAL INTERMETALLIC OF Sn-3.0Ag-0.5Cu/Sn-58Bi SOLDER JOINT FOR PACKAGE-ON-PACKAGE TECHNOLOGY |
| title_sort | microstructure and interfacial intermetallic of sn 3 0ag 0 5cu sn 58bi solder joint for package on package technology |
| topic | package on package low-temperature solder sn-58bi interfacial intermetallic |
| url | https://ejmse.ro/articles/08_02_01_EJMSE-22-164.pdf |
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