MICROSTRUCTURE AND INTERFACIAL INTERMETALLIC OF Sn-3.0Ag-0.5Cu/Sn-58Bi SOLDER JOINT FOR PACKAGE-ON-PACKAGE TECHNOLOGY

MICROSTRUCTURE AND INTERFACIAL INTERMETALLIC OF Sn-3.0Ag-0.5Cu/Sn-58Bi SOLDER JOINT FOR PACKAGE-ON-PACKAGE TECHNOLOGY

In this study, the effect of growth microstructure on diffusion and intermetallic compound of Sn-58Bi/SAC305 solder joint with different of SAC305 size and reflow temperature had been studied. For effect of different size, it used 180°C reflow temperature and 5minute reflow time with the size of SAC...

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Bibliographic Details
Main Authors: Mohd Izrul Izwan RAMLI, Rita MOHD SAID, Flora SOMIDIN, Siti Farahnabilah MUHD AMLI, Siti Nor Atirah MUSTAPHA
Format: Article
Language:English
Published: Politehnium Publishing House 2023-06-01
Series:European Journal of Materials Science and Engineering
Subjects:
package on package
low-temperature solder
sn-58bi
interfacial intermetallic
Online Access:https://ejmse.ro/articles/08_02_01_EJMSE-22-164.pdf

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