T-ray Wavelength Decoupled Imaging and Profile Mapping of a Whole Wafer for Die Sorting and Analysis
This paper describes a terahertz (T-ray) cameraless imaging and profile mapping technique for accomplishing the imaging and/or mapping of a whole wafer with fabricated dies for devising a criterion to sort out good dies. A stratagem for decoupling the wavelength’s dependence on image formation is de...
| Main Author: | |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-03-01
|
| Series: | Sensors |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1424-8220/23/7/3663 |