Enhance mechanical property and electrical conductivity simultaneously of Sn–Cu–Co solder alloys by directional solidification
Improving mechanical properties of solder alloy can result in a decrease of its conductivity. The decrease in conductivity of the solder increases the generation of Joule heat and reduces the reliability of the joint. This problem can be solved by adjusting the solidification parameters of solders....
| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-03-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424003156 |