Effects of temperature and strain rate on tensile properties of (Ag,Cu)-Sn intermetallic compounds: A molecular dynamics study
With the advent of environment friendly microelectronic packaging technologies, the demand of lead-free solders alloy has escalated. Leadfree solder material is an alloy of Tin (Sn), Silver (Ag) and Copper (Cu) and is widely known as SAC solder. Intermetallic compounds (IMC) like Ag3Sn, Cu3Sn and Cu...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785422004483 |