Simulation Research on Sparse Reconstruction for Defect Signals of Flip Chip Based on High-Frequency Ultrasound
Flip chip technology has been widely used in various fields. As the density of the solder balls in flip chip technology is increasing, the pitch among solder balls is narrowing, and the size effect is more significant. Therefore, the micro defects of the solder balls are more difficult to detect. In...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-02-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/10/4/1292 |