Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints

Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints

To solve the electromigration problem of micro−electronic connection solder joints, an ideal electromigration tester was designed, and the thickness of the intermetallic compounds (IMCs), average void diameter, grain orientation, failure, shear strength, and fracture path of Sn2.5Ag0.7Cu0.1RE0.05Ni−...

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Bibliographic Details
Main Authors: Chao Zhang, Keke Zhang, Yijie Gao, Yuming Wang
Format: Article
Language:English
Published: MDPI AG 2023-03-01
Series:Materials
Subjects:
lead−free solder joint
electromigration
interfacial IMC
grain orientation
crack
electrical properties
Online Access:https://www.mdpi.com/1996-1944/16/7/2626

Internet

https://www.mdpi.com/1996-1944/16/7/2626

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