FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation
This paper presents a 3D direct numerical simulation of buckled thin-film packaging based on transferred elastic thin-film wrinkling bonded on a compliant polymer ring. The mode change of the fabricated thin-film cap is found by measuring the thin-film cap shape at different times after Si substrate...
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-06-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/14/7/1312 |