APA (7th ed.) Citation

Seok, S. (2023). FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation. MDPI AG.

Chicago Style (17th ed.) Citation

Seok, Seonho. FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation. MDPI AG, 2023.

MLA (9th ed.) Citation

Seok, Seonho. FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation. MDPI AG, 2023.

Warning: These citations may not always be 100% accurate.