FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation
This paper presents a 3D direct numerical simulation of buckled thin-film packaging based on transferred elastic thin-film wrinkling bonded on a compliant polymer ring. The mode change of the fabricated thin-film cap is found by measuring the thin-film cap shape at different times after Si substrate...
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-06-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/14/7/1312 |
| _version_ | 1797588291074129920 |
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| author | Seonho Seok |
| author_facet | Seonho Seok |
| author_sort | Seonho Seok |
| collection | DOAJ |
| description | This paper presents a 3D direct numerical simulation of buckled thin-film packaging based on transferred elastic thin-film wrinkling bonded on a compliant polymer ring. The mode change of the fabricated thin-film cap is found by measuring the thin-film cap shape at different times after Si substrate debonding. The conventional linear and nonlinear buckling simulations are not adequate to understand the behavior of the thin-film buckling mechanism creating such packaging cap mode change. Direct buckling simulation is recently reported as an easy and useful numerical wrinkling simulation method. A novel 3D FEM model of a thin-film package suitable for direct 3D buckling simulation is built to reduce the mode mixture between different buckling modes. Buckling modes of the packaging cap are investigated in terms of elastic moduli of package materials and applied strain due to thermal expansion coefficient difference. Based on the simulation results, it is found that there are two main modes in the fabricated thin-film buckling package determining the shape of the transferred thin-film packaging cover depending on the elasticity ratio between the cap and sealing ring materials. The mode shift from wrinkling cap mode to out-of-plane cap mode due to applied strain along a polymeric sealing ring is found. |
| first_indexed | 2024-03-11T00:49:52Z |
| format | Article |
| id | doaj.art-73d6790f773a490896c0185b7b56eb93 |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-11T00:49:52Z |
| publishDate | 2023-06-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-73d6790f773a490896c0185b7b56eb932023-11-18T20:31:39ZengMDPI AGMicromachines2072-666X2023-06-01147131210.3390/mi14071312FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical SimulationSeonho Seok0Center for Nanoscience and Nanotechnology (C2N), University-Paris-Saclay, 91400 Palaiseau, FranceThis paper presents a 3D direct numerical simulation of buckled thin-film packaging based on transferred elastic thin-film wrinkling bonded on a compliant polymer ring. The mode change of the fabricated thin-film cap is found by measuring the thin-film cap shape at different times after Si substrate debonding. The conventional linear and nonlinear buckling simulations are not adequate to understand the behavior of the thin-film buckling mechanism creating such packaging cap mode change. Direct buckling simulation is recently reported as an easy and useful numerical wrinkling simulation method. A novel 3D FEM model of a thin-film package suitable for direct 3D buckling simulation is built to reduce the mode mixture between different buckling modes. Buckling modes of the packaging cap are investigated in terms of elastic moduli of package materials and applied strain due to thermal expansion coefficient difference. Based on the simulation results, it is found that there are two main modes in the fabricated thin-film buckling package determining the shape of the transferred thin-film packaging cover depending on the elasticity ratio between the cap and sealing ring materials. The mode shift from wrinkling cap mode to out-of-plane cap mode due to applied strain along a polymeric sealing ring is found.https://www.mdpi.com/2072-666X/14/7/1312direct simulationbucklingFEMpackagingthin-film |
| spellingShingle | Seonho Seok FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation Micromachines direct simulation buckling FEM packaging thin-film |
| title | FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation |
| title_full | FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation |
| title_fullStr | FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation |
| title_full_unstemmed | FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation |
| title_short | FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation |
| title_sort | fem analysis of buckled dielectric thin film packaging based on 3d direct numerical simulation |
| topic | direct simulation buckling FEM packaging thin-film |
| url | https://www.mdpi.com/2072-666X/14/7/1312 |
| work_keys_str_mv | AT seonhoseok femanalysisofbuckleddielectricthinfilmpackagingbasedon3ddirectnumericalsimulation |