In Situ Reconnection of Nanoelectrodes Over 20 nm Gaps on Polyimide Substrate

In Situ Reconnection of Nanoelectrodes Over 20 nm Gaps on Polyimide Substrate

The current densities in nowadays electronic circuitry are close to the electromigration threshold that may result in the fracture of circuits due to electromigration, hampering further miniaturization of integrated chips. Flexible electronic devices, which use a flexible material instead of rigid s...

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Bibliographic Details
Main Authors: Xubin Zhang, Zhibin Zhao, Surong Zhang, Adila Adijiang, Tianran Zhao, Min Tan, Xueyan Zhao, Qihong Hu, Maoning Wang, Takhee Lee, Elke Scheer, Dong Xiang
Format: Article
Language:English
Published: Wiley-VCH 2024-02-01
Series:Small Structures
Subjects:
metal atom trapping
nanoelectrodes
O2 plasma etching
self-healing
X-ray photoelectron spectroscopy
Online Access:https://doi.org/10.1002/sstr.202300283

Internet

https://doi.org/10.1002/sstr.202300283

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