Analysis and Verification of Heat Dissipation Structures Embedded in Substrates in Power Chips Based on Square Frustums Thermal through Silicon Vias

Analysis and Verification of Heat Dissipation Structures Embedded in Substrates in Power Chips Based on Square Frustums Thermal through Silicon Vias

A novel heat dissipation structure composed of square frustums thermal through silicon via array and embedded in P-type (100) silicon substrate is proposed to improve the heat dissipation capacity of power chips while reducing process difficulty. Based on theoretical analysis, the heat transfer mode...

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Bibliographic Details
Main Authors: Fengjie Guo, Kui Ma, Jingyang Ran, Fashun Yang
Format: Article
Language:English
Published: MDPI AG 2024-02-01
Series:Micromachines
Subjects:
thermal reliability
thermal characteristics
dissipative structure
square frustums TTSV
Online Access:https://www.mdpi.com/2072-666X/15/3/323

Internet

https://www.mdpi.com/2072-666X/15/3/323

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