Novel approach to cooling microelectronics with complex fins configuration
This paper presents a numerical simulation and optimisation of a complex microchannel featuring innovative fin designs. The primary objective of the study is to minimise resistance in the heat sink by utilizing intricate fin structures. Three different approaches are explored: firstly, cylindrical s...
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| Format: | Article |
| Language: | English |
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Elsevier
2024-02-01
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| Series: | International Journal of Thermofluids |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2666202724000016 |