Diffusion bonding of copper alloy and nickel-based superalloy via hot isostatic pressing
Joining copper alloys to nickel-based superalloys can achieve a combination of their advantages. However, joining these two dissimilar alloys is challenging due to their significant differences in properties. In this paper, the advanced hot isostatic pressing-diffusion bonding (HIP-DB) technology wa...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-07-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785422008134 |