Polishing Performance and Removal Mechanism of Core-Shell Structured Diamond/SiO<sub>2</sub> Abrasives on Sapphire Wafer

Polishing Performance and Removal Mechanism of Core-Shell Structured Diamond/SiO<sub>2</sub> Abrasives on Sapphire Wafer

Corrosive and toxic solutions are normally employed to polish sapphire wafers, which easily cause environmental pollution. Applying green polishing techniques to obtain an ultrasmooth sapphire surface that is scratch-free and has low damage at high polishing efficiency is a great challenge. In this...

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Bibliographic Details
Main Authors: Guangen Zhao, Yongchao Xu, Qianting Wang, Jun Liu, Youji Zhan, Bingsan Chen
Format: Article
Language:English
Published: MDPI AG 2022-12-01
Series:Micromachines
Subjects:
polishing
sapphire
core shell
composite abrasives
surface roughness
material removal rate
Online Access:https://www.mdpi.com/2072-666X/13/12/2160

Internet

https://www.mdpi.com/2072-666X/13/12/2160

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