Polishing Performance and Removal Mechanism of Core-Shell Structured Diamond/SiO<sub>2</sub> Abrasives on Sapphire Wafer
Corrosive and toxic solutions are normally employed to polish sapphire wafers, which easily cause environmental pollution. Applying green polishing techniques to obtain an ultrasmooth sapphire surface that is scratch-free and has low damage at high polishing efficiency is a great challenge. In this...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-12-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/13/12/2160 |
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| author | Guangen Zhao Yongchao Xu Qianting Wang Jun Liu Youji Zhan Bingsan Chen |
| author_facet | Guangen Zhao Yongchao Xu Qianting Wang Jun Liu Youji Zhan Bingsan Chen |
| author_sort | Guangen Zhao |
| collection | DOAJ |
| description | Corrosive and toxic solutions are normally employed to polish sapphire wafers, which easily cause environmental pollution. Applying green polishing techniques to obtain an ultrasmooth sapphire surface that is scratch-free and has low damage at high polishing efficiency is a great challenge. In this paper, novel diamond/SiO<sub>2</sub> composite abrasives were successfully synthesized by a simplified sol-gel strategy. The prepared composite abrasives were used in the semi-fixed polishing technology of sapphire wafers, where the polishing slurry contains only deionized water and no other chemicals during the whole polishing process, effectively avoiding environmental pollution. The experimental results showed that diamond/SiO<sub>2</sub> composite abrasives exhibited excellent polishing performance, along with a 27.2% decrease in surface roughness, and the material removal rate was increased by more than 8.8% compared with pure diamond. Furthermore, through characterizations of polished sapphire surfaces and wear debris, the chemical action mechanism of composite abrasives was investigated, which confirmed the solid-state reaction between the SiO<sub>2</sub> shell and the sapphire surface. Finally, applying the elastic-plastic contact model revealed that the reduction of indentation depth and the synergistic effect of chemical corrosion and mechanical removal are the keys to improving polishing performance. |
| first_indexed | 2024-03-09T16:05:12Z |
| format | Article |
| id | doaj.art-75fdf55e188f4f479dd71123e478d1a9 |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-09T16:05:12Z |
| publishDate | 2022-12-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-75fdf55e188f4f479dd71123e478d1a92023-11-24T16:45:11ZengMDPI AGMicromachines2072-666X2022-12-011312216010.3390/mi13122160Polishing Performance and Removal Mechanism of Core-Shell Structured Diamond/SiO<sub>2</sub> Abrasives on Sapphire WaferGuangen Zhao0Yongchao Xu1Qianting Wang2Jun Liu3Youji Zhan4Bingsan Chen5School of Materials Science and Engineering, Fujian University of Technology, Fuzhou 350118, ChinaSchool of Materials Science and Engineering, Fujian University of Technology, Fuzhou 350118, ChinaSchool of Materials Science and Engineering, Fujian University of Technology, Fuzhou 350118, ChinaSchool of Materials Science and Engineering, Fujian University of Technology, Fuzhou 350118, ChinaFujian Key Laboratory of Intelligent Machining Technology and Equipment, Fujian University of Technology, Fuzhou 350118, ChinaFujian Key Laboratory of Intelligent Machining Technology and Equipment, Fujian University of Technology, Fuzhou 350118, ChinaCorrosive and toxic solutions are normally employed to polish sapphire wafers, which easily cause environmental pollution. Applying green polishing techniques to obtain an ultrasmooth sapphire surface that is scratch-free and has low damage at high polishing efficiency is a great challenge. In this paper, novel diamond/SiO<sub>2</sub> composite abrasives were successfully synthesized by a simplified sol-gel strategy. The prepared composite abrasives were used in the semi-fixed polishing technology of sapphire wafers, where the polishing slurry contains only deionized water and no other chemicals during the whole polishing process, effectively avoiding environmental pollution. The experimental results showed that diamond/SiO<sub>2</sub> composite abrasives exhibited excellent polishing performance, along with a 27.2% decrease in surface roughness, and the material removal rate was increased by more than 8.8% compared with pure diamond. Furthermore, through characterizations of polished sapphire surfaces and wear debris, the chemical action mechanism of composite abrasives was investigated, which confirmed the solid-state reaction between the SiO<sub>2</sub> shell and the sapphire surface. Finally, applying the elastic-plastic contact model revealed that the reduction of indentation depth and the synergistic effect of chemical corrosion and mechanical removal are the keys to improving polishing performance.https://www.mdpi.com/2072-666X/13/12/2160polishingsapphirecore shellcomposite abrasivessurface roughnessmaterial removal rate |
| spellingShingle | Guangen Zhao Yongchao Xu Qianting Wang Jun Liu Youji Zhan Bingsan Chen Polishing Performance and Removal Mechanism of Core-Shell Structured Diamond/SiO<sub>2</sub> Abrasives on Sapphire Wafer Micromachines polishing sapphire core shell composite abrasives surface roughness material removal rate |
| title | Polishing Performance and Removal Mechanism of Core-Shell Structured Diamond/SiO<sub>2</sub> Abrasives on Sapphire Wafer |
| title_full | Polishing Performance and Removal Mechanism of Core-Shell Structured Diamond/SiO<sub>2</sub> Abrasives on Sapphire Wafer |
| title_fullStr | Polishing Performance and Removal Mechanism of Core-Shell Structured Diamond/SiO<sub>2</sub> Abrasives on Sapphire Wafer |
| title_full_unstemmed | Polishing Performance and Removal Mechanism of Core-Shell Structured Diamond/SiO<sub>2</sub> Abrasives on Sapphire Wafer |
| title_short | Polishing Performance and Removal Mechanism of Core-Shell Structured Diamond/SiO<sub>2</sub> Abrasives on Sapphire Wafer |
| title_sort | polishing performance and removal mechanism of core shell structured diamond sio sub 2 sub abrasives on sapphire wafer |
| topic | polishing sapphire core shell composite abrasives surface roughness material removal rate |
| url | https://www.mdpi.com/2072-666X/13/12/2160 |
| work_keys_str_mv | AT guangenzhao polishingperformanceandremovalmechanismofcoreshellstructureddiamondsiosub2subabrasivesonsapphirewafer AT yongchaoxu polishingperformanceandremovalmechanismofcoreshellstructureddiamondsiosub2subabrasivesonsapphirewafer AT qiantingwang polishingperformanceandremovalmechanismofcoreshellstructureddiamondsiosub2subabrasivesonsapphirewafer AT junliu polishingperformanceandremovalmechanismofcoreshellstructureddiamondsiosub2subabrasivesonsapphirewafer AT youjizhan polishingperformanceandremovalmechanismofcoreshellstructureddiamondsiosub2subabrasivesonsapphirewafer AT bingsanchen polishingperformanceandremovalmechanismofcoreshellstructureddiamondsiosub2subabrasivesonsapphirewafer |