Plasma etching for fabrication of complex nanophotonic lasers from bonded InP semiconductor layers
Integrating optically active III-V materials on silicon/insulator platforms is one potential path towards improving the energy efficiency and performance of modern computing. Here we demonstrate the applicability of direct wafer bonding combined with plasma etching to the fabrication of complex nano...
| Auteurs principaux: | , , , , , , , |
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| Format: | Article |
| Langue: | English |
| Publié: |
Elsevier
2023-06-01
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| Collection: | Micro and Nano Engineering |
| Sujets: | |
| Accès en ligne: | http://www.sciencedirect.com/science/article/pii/S2590007223000266 |