Improving the Thickness Uniformity of Micro Gear by Multi-Step, Self-Aligned Lithography and Electroforming

Improving the Thickness Uniformity of Micro Gear by Multi-Step, Self-Aligned Lithography and Electroforming

The thickness nonuniformity of an electroformed layer is a bottleneck problem for electroformed micro metal devices. In this paper, a new fabrication method is proposed to improve the thickness uniformity of micro gear, which is the key element of various microdevices. The effect of the thickness of...

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Bibliographic Details
Main Authors: Huan Wang, Jing Xie, Tao Fan, Dapeng Sun, Chaobo Li
Format: Article
Language:English
Published: MDPI AG 2023-03-01
Series:Micromachines
Subjects:
micro-electroforming
thickness uniformity
self-aligned lithography
roughness
Online Access:https://www.mdpi.com/2072-666X/14/4/775

Internet

https://www.mdpi.com/2072-666X/14/4/775

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