Removal Characteristics of Sapphire Lapping using Composite Plates with Consciously Patterned Resinoid-Bonded Semifixed Diamond Grits
Sapphire lapping is of key importance for the successful planarization of wafers that are widely present in electronic devices. However, the high hardness of sapphire makes it extremely challenging to improve its material removal rate during the lapping process without compromising surface quality a...
| Hlavní autoři: | , , , , , |
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| Médium: | Článek |
| Jazyk: | English |
| Vydáno: |
MDPI AG
2020-04-01
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| Edice: | Crystals |
| Témata: | |
| On-line přístup: | https://www.mdpi.com/2073-4352/10/4/293 |