APA (7th ed.) Citation

Wang, W., Yu, Y., Hu, Z., Fang, C., Lu, J., & Xu, X. (2020). Removal Characteristics of Sapphire Lapping using Composite Plates with Consciously Patterned Resinoid-Bonded Semifixed Diamond Grits. MDPI AG.

Chicago Style (17th ed.) Citation

Wang, Wenshan, Yiqing Yu, Zhongwei Hu, Congfu Fang, Jing Lu, and Xipeng Xu. Removal Characteristics of Sapphire Lapping Using Composite Plates with Consciously Patterned Resinoid-Bonded Semifixed Diamond Grits. MDPI AG, 2020.

MLA (9th ed.) Citation

Wang, Wenshan, et al. Removal Characteristics of Sapphire Lapping Using Composite Plates with Consciously Patterned Resinoid-Bonded Semifixed Diamond Grits. MDPI AG, 2020.