Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices

Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices

Silicon-based microchannel technology offers unmatched performance in the cooling of silicon pixel detectors in high-energy physics. Although Si–Si direct bonding, used for the fabrication of cooling plates, also meets the stringent requirements of this application (its high-pressure resistance of ~...

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Bibliographic Details
Main Authors: Sylwester Bargiel, Julien Cogan, Samuel Queste, Stefania Oliveri, Ludovic Gauthier-Manuel, Marina Raschetti, Olivier Leroy, Stéphan Beurthey, Mathieu Perrin-Terrin
Format: Article
Language:English
Published: MDPI AG 2023-06-01
Series:Micromachines
Subjects:
bonding technology
anodic bonding
thermocompression bonding
microcooling
microfluidic device
burst pressure test
Online Access:https://www.mdpi.com/2072-666X/14/7/1297

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https://www.mdpi.com/2072-666X/14/7/1297

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